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Materials for High-Density Electronic Packaging and Interconnection
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Electronic packaging and interconnections are the elements that today limit the ultimate performance of
advanced electronic systems. Materials in use today and those becoming available are critically examined to
ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced
electronics. Materials and processes are discussed in terms of the final properties achievable and systems design
compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and
political, are identified. Recommendations are presented for actions that could help U.S. industry regain its
former leadership position in advanced semiconductor systems production
National Academies - Personal Name
0-309-53669-3
NONE
Materials for High-Density Electronic Packaging and Interconnection
Information Technology
English
National Academies Press
1990
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